Supports Manufacturing in a production and engineering environment in the assembly of standard and new products and as they pertain to MIC. Daily functions are performed under a microscope along with other high precision equipment.
DUTIES AND RESPONSIBILITIES:
- Working within an engineering environment in the assembly process. May assist in the development of assembly methods and processes for new designs. This includes working with minimal documentation and/ or red-lined drawings.
- Working knowledge of MIL-STD-883 as it applies to assembly methods.
- Performs die attach and wire (ball and wedge) / ribbon bonding of RF substrates, circuits and components using a variety of epoxies and solders.
- Uses small hand tools and equipment under a microscope.
- Familiar with the use and routine care of common MIC laboratory equipment including manual wire and ribbon bonders (ie: West Bond; Mech-El), bond-pull testers, solder reflow stations, and plasma cleaners.
- Reads and interprets schematics, parts lists, travelers, rework instructions and process procedures to properly assemble a variety of designs.
- Capable of holding mechanical tolerances to rigid specifications (often +/- .001”), using a variety of measurement and calibration equipment such as microscope-mounted reticules, calipers and micrometers.
- Use of basic computer skills and Microsoft applications (such as Word, Excel, Access and Outlook) to communicate information between departments.
- Experience in soldering to IPC-610 and J-STD-001 a plus.
- Maintains a positive work environment by professional and courteous conduct and communications with others, including supervisors and co-workers.EDUCATION REQUIRED: High School diploma or equivalent.
Additional technical training a plus. 5 years of related experience including use of a microscope and related equipment required. Experience with Wedge bonding.
Job ID: 16446