Position requires HDI PCB design experience. HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs. Candidate should also have experience routing DDR3, Differential pairs and phase matching of signal up to 10 Gb/s. Must have Cadence Allegro version 16 or higher tool set experience. • IPC certification CID or CID+ preferred.
Cadence-Allegro experience. Must be recent or current exp.
HDI experience a must
Job ID: 16848