Company Type
Manufacturer
Location
Garden City, New York
Job Description
- Possesses the knowledge and skill set of assembling complex microelectronics systems
- Must be able to supervise and coordinate the work of employees who work on the production floor
- Will prepare work schedules, assign work, oversee production and ensures employees follow proper policies and procedures
Job Skills
- Must be able to conduct assembler training and maintain training records
- High School Diploma or equivalent with a minimum of 5 years’ experience in assembly operations
Must be proficient in the following concentrations
- Thin Film High Frequency Multi Chip Module Production
- Wire Bonding – Manual Thermosonic Wedge Bonding
- Ribbon Bonding – Parallel Gap, Hot Tip, Thermosonic Wedge
- Die Attachment—Eutectic, Epoxy
- Surface Mount Technology—Hand Soldering
- Process Control—Destruct & Non-Destruct Pull Testing, Die Shear Testing
- Hermetic Welding—Parallel Resistance Welding
Job ID: 16329