Company Type
Manufacturer
Location
Farmingdale, New York
Job Description
• Assemble thick film and thin film hybrid devices from initial phase to completion using parts lists, production flow travelers, wiring schematics, and assembly drawings.
Job Skills
• Possesses the knowledge and skill set of assembling complex microelectronic systems
• Skills required for hybrid assembly operations of various microelectronic modules include thermosonic ball bonding, aluminum and gold wedge bonding, manual pick-and-placement of die and surface mount components, and eutectic die attachment.
Job ID: 5621
