Company Type
Manufacturer
Location
Hauppauge, New York
Job Description
- Performs various production assembly operations on micro-electronic component and subassemblies under a microscope.
- Soldering, die bonding, wedge bonding, ball bonding and parallel gap welding under a microscope.
- Must have the ability to build prototypes and models and revise prints from written and oral instructions.
- Complete complex assignments and work independently.
- Comprehend detailed instructions using visual aids, drawings, and verbal and written instructions to assemble, rework, or reassemble units in a manner acceptable to Quality 883 Standards.
- Ability and interest to learn the basic knowledge and function of micro-electronic components as well as apply oneself to constructive guidance and strive to improve to reach the next level.
- Adjust settings on bonding machines and gap welder with full understanding of the purpose without supervision.
- Read and interpret assembly print and Bills of Material (BOM) and recognize components by their designation.
- Knowledge of all phases of micro assembly and ability to perform each function well.
- Good eye/hand coordination to work under a microscope.
Job Skills
- Working with cleaning solvents.
- Perform other duties as necessary and as assigned, such as inprocess inspection, sealing, securing chemical supplies, printing, pull test on machine.
- Must be available to work overtime if needed.
- Education: High School graduate, or equivalent.
- Minimum of 5-10 years experience in micro-assembly.
Job ID: 3101
