Company Type
Manufacturer
Location
Farmingdale, New York
Job Description
- Electronics packaging design for RF-antennas exposed to stringent dynamic structural and thermal environments for airborne, shipboard, ground mobile and ground based applications.
- Position encompasses manufacturing processes and design related to: CNC machining, PCB design, soldering, composites, castings, injection molding, tooling, assembly line applications etc.
- Bachelor’s degree and 6+ years of relevant experience, OR, Master’s degree and 4+ years of relevant experience.
- Electronics packaging design.
- Experience in production support of medium to high volume product lines including ECN and MRB support.
- Experience in design to meet cost objectives.
- Experience in rapid prototype methods.
Job Skills
- Computer Aided Design experience, in particular use of CREO 2.
- Knowledge of ANSI Y14 drawing practices, dimensioning and tolerancing.
- Knowledge of Environmental Test Methods per Mil-STD-810 and DO 160 and experience in support of environmental testing and writing of procedures and reports.
- Analysis experience for Structural, Dynamic and Thermal Analysis.
- Strong communications skills. Ability to prepare and present at PDR and CDR functions.
- Demonstrated ability to lead cross functional teams for successful completion of project objectives within stringent technical and schedule requirements.
- Capable of independent execution, self-motivated, self-started.
- Knowledge of manufacturing processes and design related to: CNC machining, PCB design, soldering, composites, castings, injection molding, tooling, assembly line applications etc.
- Security Clearance:
- Please be aware many of our positions require the ability to obtain one. Security clearances may only be granted to U.S. citizens. In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information.
Job ID: 14014
